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An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 10, 页码: 1788-1799
Authors:  Zhou, Hao;  Zhu, Hengliang;  Cui, Tao;  Pan, David Z.;  Zhou, Dian;  Zeng, Xuan
Favorite  |  View/Download:5/0  |  Submit date:2018/11/16
Domain decomposition (DD)  drop test  reliability  through-silicon via (TSV)  
An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 10, 页码: 1788
Authors:  Zhou, Hao;  Zhu, Hengliang;  Cui, Tao;  Pan, David Z.;  Zhou, Dian;  Zeng, Xuan
Favorite  |  View/Download:0/0  |  Submit date:2019/12/31
Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2018, 卷号: 26, 期号: 7, 页码: 1312
Authors:  Zhou, Hao;  Zhu, Hengliang;  Cui, Tao;  Pan, David Z.;  Zhou, Dian;  Zeng, Xuan
Favorite  |  View/Download:0/0  |  Submit date:2019/12/31
纳米集成电路互连线建模和光刻仿真中的大规模并行计算方法 期刊论文
中国科学信息科学, 2016, 卷号: 46, 期号: 10, 页码: 1372
Authors:  朱恒亮;  曾璇;  崔涛;  严昌浩;  张林波
Favorite  |  View/Download:0/0  |  Submit date:2020/01/10