KMS Of Academy of mathematics and systems sciences, CAS
| An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs | |
Zhou, Hao1; Zhu, Hengliang1; Cui, Tao2 ; Pan, David Z.1,3; Zhou, Dian1,4; Zeng, Xuan1
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| 2018-10-01 | |
| Source Publication | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
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| ISSN | 2156-3950 |
| Volume | 8Issue:10Pages:1788-1799 |
| Abstract | Drop test is usually adopted in the integrated circuit (IC) testing to estimate the shock resistance capability of IC packaging. Generally, it is very time-consuming for the drop test simulation, and therefore the fast numerical approach is needed to reduce the computational cost. In this paper, we propose an efficient drop test simulator for through-silicon-via (TSV)based 3-D IC to simulate its mechanical behaviors under drop impact. The proposed simulator is based on the idea of domain decomposition (DD) to improve the condition number of the coefficient matrix of the solver. We further develop two efficient numerical techniques in the simulator to improve its efficiency. First, a second-order formulation is proposed for the initial solution selection in preconditioned conjugate gradient (PCG) solver, which can efficiently reduce the number of PCG iterations at each time point during simulation. Second, an equivalent structure-embedded model is proposed and applied in the first Schwarz iteration to efficiently reduce the number of Schwarz iterations in DD method. Numerical experiments show that the proposed drop test simulator can achieve 7.03x speedup in comparison with the conventional finite-element method-based solver. It is demonstrated in this paper through several examples with multichip layers, of which each chip layer consists of an 8 x 8 TSV array, that the proposed simulator can be widely applied to reliability analysis of 3-D ICs under drop impact. |
| Keyword | Domain decomposition (DD) drop test reliability through-silicon via (TSV) |
| DOI | 10.1109/TCPMT.2018.2853157 |
| Language | 英语 |
| Funding Project | National Key Research and Development Program of China[2016YFB0201304] ; National Natural Science Foundation of China Research Project[61376040] ; National Natural Science Foundation of China Research Project[61574046] ; National Natural Science Foundation of China Research Project[61774045] ; National Natural Science Foundation of China Research Project[61574044] ; National Natural Science Foundation of China Research Project[61628402] ; National Natural Science Foundation of China Research Project[11771440] ; National Natural Science Foundation of China Research Project[91530323] ; National Natural Science Foundation of China Research Project[11101417] ; Key Research Program of the Chinese Academy of Sciences[XDPB11] ; Recruitment Program of Global Experts through the Thousand Talents Plan |
| WOS Research Area | Engineering ; Materials Science |
| WOS Subject | Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary |
| WOS ID | WOS:000447078400009 |
| Publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.amss.ac.cn/handle/2S8OKBNM/31428 |
| Collection | 计算数学与科学工程计算研究所 |
| Corresponding Author | Zhu, Hengliang; Zeng, Xuan |
| Affiliation | 1.Fudan Univ, State Key Lab ASIC & Syst, Dept Microelect, Shanghai 200433, Peoples R China 2.Chinese Acad Sci, State Key Lab Sci & Engn Comp, Natl Ctr Math & Interdisciplinary Sci, Inst Computat Math,Acad Math & Syst Sci, Beijing 100190, Peoples R China 3.Univ Texas Austin, Dept Elect & Comp Engn, Austin, TX 78712 USA 4.Univ Texas Dallas, Dept Elect Engn, Richardson, TX 75080 USA |
| Recommended Citation GB/T 7714 | Zhou, Hao,Zhu, Hengliang,Cui, Tao,et al. An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(10):1788-1799. |
| APA | Zhou, Hao,Zhu, Hengliang,Cui, Tao,Pan, David Z.,Zhou, Dian,&Zeng, Xuan.(2018).An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,8(10),1788-1799. |
| MLA | Zhou, Hao,et al."An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 8.10(2018):1788-1799. |
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