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An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 10, 页码: 1788-1799
Authors:  Zhou, Hao;  Zhu, Hengliang;  Cui, Tao;  Pan, David Z.;  Zhou, Dian;  Zeng, Xuan
Favorite  |  View/Download:4/0  |  Submit date:2018/11/16
Domain decomposition (DD)  drop test  reliability  through-silicon via (TSV)