CSpace  > 计算数学与科学工程计算研究所
 An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs Zhou, Hao1; Zhu, Hengliang1; Cui, Tao2; Pan, David Z.1,3; Zhou, Dian1,4; Zeng, Xuan1 2018-10-01 Source Publication IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY ISSN 2156-3950 Volume 8Issue:10Pages:1788-1799 Abstract Drop test is usually adopted in the integrated circuit (IC) testing to estimate the shock resistance capability of IC packaging. Generally, it is very time-consuming for the drop test simulation, and therefore the fast numerical approach is needed to reduce the computational cost. In this paper, we propose an efficient drop test simulator for through-silicon-via (TSV)based 3-D IC to simulate its mechanical behaviors under drop impact. The proposed simulator is based on the idea of domain decomposition (DD) to improve the condition number of the coefficient matrix of the solver. We further develop two efficient numerical techniques in the simulator to improve its efficiency. First, a second-order formulation is proposed for the initial solution selection in preconditioned conjugate gradient (PCG) solver, which can efficiently reduce the number of PCG iterations at each time point during simulation. Second, an equivalent structure-embedded model is proposed and applied in the first Schwarz iteration to efficiently reduce the number of Schwarz iterations in DD method. Numerical experiments show that the proposed drop test simulator can achieve 7.03x speedup in comparison with the conventional finite-element method-based solver. It is demonstrated in this paper through several examples with multichip layers, of which each chip layer consists of an 8 x 8 TSV array, that the proposed simulator can be widely applied to reliability analysis of 3-D ICs under drop impact. Keyword Domain decomposition (DD) drop test reliability through-silicon via (TSV) DOI 10.1109/TCPMT.2018.2853157 Language 英语 Funding Project National Key Research and Development Program of China[2016YFB0201304] ; National Natural Science Foundation of China Research Project[61376040] ; National Natural Science Foundation of China Research Project[61574046] ; National Natural Science Foundation of China Research Project[61774045] ; National Natural Science Foundation of China Research Project[61574044] ; National Natural Science Foundation of China Research Project[61628402] ; National Natural Science Foundation of China Research Project[11771440] ; National Natural Science Foundation of China Research Project[91530323] ; National Natural Science Foundation of China Research Project[11101417] ; Key Research Program of the Chinese Academy of Sciences[XDPB11] ; Recruitment Program of Global Experts through the Thousand Talents Plan WOS Research Area Engineering ; Materials Science WOS Subject Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary WOS ID WOS:000447078400009 Publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC Citation statistics Document Type 期刊论文 Identifier http://ir.amss.ac.cn/handle/2S8OKBNM/31428 Collection 计算数学与科学工程计算研究所 Corresponding Author Zhu, Hengliang; Zeng, Xuan Affiliation 1.Fudan Univ, State Key Lab ASIC & Syst, Dept Microelect, Shanghai 200433, Peoples R China2.Chinese Acad Sci, State Key Lab Sci & Engn Comp, Natl Ctr Math & Interdisciplinary Sci, Inst Computat Math,Acad Math & Syst Sci, Beijing 100190, Peoples R China3.Univ Texas Austin, Dept Elect & Comp Engn, Austin, TX 78712 USA4.Univ Texas Dallas, Dept Elect Engn, Richardson, TX 75080 USA Recommended CitationGB/T 7714 Zhou, Hao,Zhu, Hengliang,Cui, Tao,et al. An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(10):1788-1799. APA Zhou, Hao,Zhu, Hengliang,Cui, Tao,Pan, David Z.,Zhou, Dian,&Zeng, Xuan.(2018).An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,8(10),1788-1799. MLA Zhou, Hao,et al."An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 8.10(2018):1788-1799.
 Files in This Item: There are no files associated with this item.
 Related Services Recommend this item Bookmark Usage statistics Export to Endnote Google Scholar Similar articles in Google Scholar [Zhou, Hao]'s Articles [Zhu, Hengliang]'s Articles [Cui, Tao]'s Articles Baidu academic Similar articles in Baidu academic [Zhou, Hao]'s Articles [Zhu, Hengliang]'s Articles [Cui, Tao]'s Articles Bing Scholar Similar articles in Bing Scholar [Zhou, Hao]'s Articles [Zhu, Hengliang]'s Articles [Cui, Tao]'s Articles Terms of Use No data! Social Bookmark/Share