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An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs
Zhou, Hao1; Zhu, Hengliang1; Cui, Tao2; Pan, David Z.1,3; Zhou, Dian1,4; Zeng, Xuan1
2018-10-01
Source PublicationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
ISSN2156-3950
Volume8Issue:10Pages:1788-1799
AbstractDrop test is usually adopted in the integrated circuit (IC) testing to estimate the shock resistance capability of IC packaging. Generally, it is very time-consuming for the drop test simulation, and therefore the fast numerical approach is needed to reduce the computational cost. In this paper, we propose an efficient drop test simulator for through-silicon-via (TSV)based 3-D IC to simulate its mechanical behaviors under drop impact. The proposed simulator is based on the idea of domain decomposition (DD) to improve the condition number of the coefficient matrix of the solver. We further develop two efficient numerical techniques in the simulator to improve its efficiency. First, a second-order formulation is proposed for the initial solution selection in preconditioned conjugate gradient (PCG) solver, which can efficiently reduce the number of PCG iterations at each time point during simulation. Second, an equivalent structure-embedded model is proposed and applied in the first Schwarz iteration to efficiently reduce the number of Schwarz iterations in DD method. Numerical experiments show that the proposed drop test simulator can achieve 7.03x speedup in comparison with the conventional finite-element method-based solver. It is demonstrated in this paper through several examples with multichip layers, of which each chip layer consists of an 8 x 8 TSV array, that the proposed simulator can be widely applied to reliability analysis of 3-D ICs under drop impact.
KeywordDomain decomposition (DD) drop test reliability through-silicon via (TSV)
DOI10.1109/TCPMT.2018.2853157
Language英语
Funding ProjectNational Key Research and Development Program of China[2016YFB0201304] ; National Natural Science Foundation of China Research Project[61376040] ; National Natural Science Foundation of China Research Project[61574046] ; National Natural Science Foundation of China Research Project[61774045] ; National Natural Science Foundation of China Research Project[61574044] ; National Natural Science Foundation of China Research Project[61628402] ; National Natural Science Foundation of China Research Project[11771440] ; National Natural Science Foundation of China Research Project[91530323] ; National Natural Science Foundation of China Research Project[11101417] ; Key Research Program of the Chinese Academy of Sciences[XDPB11] ; Recruitment Program of Global Experts through the Thousand Talents Plan
WOS Research AreaEngineering ; Materials Science
WOS SubjectEngineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary
WOS IDWOS:000447078400009
PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
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Document Type期刊论文
Identifierhttp://ir.amss.ac.cn/handle/2S8OKBNM/31428
Collection计算数学与科学工程计算研究所
Affiliation1.Fudan Univ, State Key Lab ASIC & Syst, Dept Microelect, Shanghai 200433, Peoples R China
2.Chinese Acad Sci, State Key Lab Sci & Engn Comp, Natl Ctr Math & Interdisciplinary Sci, Inst Computat Math,Acad Math & Syst Sci, Beijing 100190, Peoples R China
3.Univ Texas Austin, Dept Elect & Comp Engn, Austin, TX 78712 USA
4.Univ Texas Dallas, Dept Elect Engn, Richardson, TX 75080 USA
Recommended Citation
GB/T 7714
Zhou, Hao,Zhu, Hengliang,Cui, Tao,et al. An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(10):1788-1799.
APA Zhou, Hao,Zhu, Hengliang,Cui, Tao,Pan, David Z.,Zhou, Dian,&Zeng, Xuan.(2018).An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,8(10),1788-1799.
MLA Zhou, Hao,et al."An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 8.10(2018):1788-1799.
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