Optimization on benzocyclobutene-based CMUT fabrication with an inverse structure

doi:10.1016/j.sna.2018.08.036

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	Optimization on benzocyclobutene-based CMUT fabrication with an inverse structure
	Li, Zhenhao 1; Na, Shuai 1; Chen, Albert I. H.1; Wong, Lawrence L. P.1; Sun, Zhendong3 ; Liu, Ping 4; Yeow, John T. W.1,2
	2018-10-01
发表期刊	SENSORS AND ACTUATORS A-PHYSICAL
ISSN	0924-4247
卷号	281 页码:1-8
摘要	It has been demonstrated that the adhesive wafer bonding technique benefits the fabrication of capacitive micromachined ultrasonic transducers (CMUTs) in the aspects of structural flexibility, CMOS process compatibility, and fabrication yield. Recently, the feasibility of fabricating CMUTs using benzocyclobutene (BCB) based polymer as both the adhesive and structural material was reported. However, the issues of voids at the wafer bonding interface, material deformation and electrode distance control need to be addressed. In this paper, we present an improved fabrication process that allows a void-free device with reduced polymer deformation. The chemical reactions during the BCB curing process were revealed using Fourier transform infrared spectroscopy. Microscopy and cross-sectional SEM images were employed to illustrate the structure improvement in terms of voids and polymer deformation. In addition, an inverse structure that allows an accurate control of the effective electrode distance was presented. The cross-sectional SEM images and the impedance measurement showing the dynamic response of the CMUT demonstrated the feasibility of this inverse structure. The differences between the inverse structure and the conventional structure were also discussed and compared. (C) 2018 Elsevier B.V. All rights reserved.
关键词	Capacitive micromachined ultrasonic transducer Adhesive wafer bonding Photosensitive benzocyclobutene Resonator
DOI	10.1016/j.sna.2018.08.036
语种	英语
资助项目	Natural Sciences and Engineering Research Council of Canada ; CMC Microsystems
WOS研究方向	Engineering ; Instruments & Instrumentation
WOS类目	Engineering, Electrical & Electronic ; Instruments & Instrumentation
WOS记录号	WOS:000447476300001
出版者	ELSEVIER SCIENCE SA
引用统计
文献类型	期刊论文
条目标识符	http://ir.amss.ac.cn/handle/2S8OKBNM/31389
专题	系统科学研究所
通讯作者	Liu, Ping; Yeow, John T. W.
作者单位	1.Univ Waterloo, Dept Syst Design Engn, 200 Univ Ave W, Waterloo, ON N2L 3G1, Canada 2.Univ Waterloo, Waterloo Inst Nanotechnol, 200 Univ Ave W, Waterloo, ON N2L 3G1, Canada 3.Chinese Acad Sci, Acad Math & Syst Sci, Key Lab Syst Control, Beijing 100190, Peoples R China 4.Dongguan Univ Technol, Sch Elect Engn & Intelligentizat, Dongguan 523808, Guangdong, Peoples R China
推荐引用方式 GB/T 7714	Li, Zhenhao,Na, Shuai,Chen, Albert I. H.,et al. Optimization on benzocyclobutene-based CMUT fabrication with an inverse structure[J]. SENSORS AND ACTUATORS A-PHYSICAL,2018,281:1-8.
APA	Li, Zhenhao.,Na, Shuai.,Chen, Albert I. H..,Wong, Lawrence L. P..,Sun, Zhendong.,...&Yeow, John T. W..(2018).Optimization on benzocyclobutene-based CMUT fabrication with an inverse structure.SENSORS AND ACTUATORS A-PHYSICAL,281,1-8.
MLA	Li, Zhenhao,et al."Optimization on benzocyclobutene-based CMUT fabrication with an inverse structure".SENSORS AND ACTUATORS A-PHYSICAL 281(2018):1-8.