Investigations on the deformation behavior of polycrystalline Cu nanowires and some factors affecting the modulus and yield strength

doi:10.1088/0965-0393/18/5/055011

	Investigations on the deformation behavior of polycrystalline Cu nanowires and some factors affecting the modulus and yield strength
	Tian, Xia; Cui, Junzhi; Li, Bowen; Xiang, Meizhen
	2010-07-01
发表期刊	MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING
ISSN	0965-0393
卷号	18 期号:5 页码:20
摘要	This paper consists of two parts. In the first part, the deformation behavior of polycrystalline Cu nanowires under tension, bending and torsion is studied by using molecular dynamics simulations. The results show that both free surfaces and grain boundaries can control the plastic deformation. In detail, for polycrystalline Cu nanowires under tension, the stress-assisted grain growth caused by atomic diffusion and grain boundary migration is found, which is thought to be the reason for necking. Then under the bending effect, full dislocations and deformation twins of polycrystalline Cu nanowires are found in the grains. Moreover, the twin boundaries act as obstacles to dislocation motion. Finally, full dislocations and fivefold deformation twins are detected in polycrystalline Cu nanowires in the torsional state. These phenomena are in good agreement with the experimental observations of Liao et al (2005 Appl. Phys. Lett. 86 103112). The second part investigates the effects of sample shape and crystallographic structure on the modulus and yield strength under tension, bending and torsion. The results demonstrate that the modulus (in particular the bending and torsion modulus) can be significantly influenced by both the effects; however, remarkable difference in yield strength can merely be caused by different crystallographic structures (here, different crystallographic structures refer to polycrystalline and single-crystalline structures).
DOI	10.1088/0965-0393/18/5/055011
语种	英语
资助项目	Special Funds for the National Basic Research Program of China (973 Program)[2010CB832702] ; National Natural Science Foundation of China[90916027]
WOS研究方向	Materials Science ; Physics
WOS类目	Materials Science, Multidisciplinary ; Physics, Applied
WOS记录号	WOS:000279003900011
出版者	IOP PUBLISHING LTD
引用统计
文献类型	期刊论文
条目标识符	http://ir.amss.ac.cn/handle/2S8OKBNM/10914
专题	计算数学与科学工程计算研究所
通讯作者	Tian, Xia
作者单位	Chinese Acad Sci, Acad Math & Syst Sci, ICMSEC, LSEC, Beijing 100190, Peoples R China
推荐引用方式 GB/T 7714	Tian, Xia,Cui, Junzhi,Li, Bowen,et al. Investigations on the deformation behavior of polycrystalline Cu nanowires and some factors affecting the modulus and yield strength[J]. MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING,2010,18(5):20.
APA	Tian, Xia,Cui, Junzhi,Li, Bowen,&Xiang, Meizhen.(2010).Investigations on the deformation behavior of polycrystalline Cu nanowires and some factors affecting the modulus and yield strength.MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING,18(5),20.
MLA	Tian, Xia,et al."Investigations on the deformation behavior of polycrystalline Cu nanowires and some factors affecting the modulus and yield strength".MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING 18.5(2010):20.