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Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2018, 卷号: 26, 期号: 7, 页码: 1312
Authors:  Zhou, Hao;  Zhu, Hengliang;  Cui, Tao;  Pan, David Z.;  Zhou, Dian;  Zeng, Xuan
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