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Economic Design of a Linear Consecutively Connected System Considering Cost and Signal Loss 期刊论文
IEEE TRANSACTIONS ON SYSTEMS MAN CYBERNETICS-SYSTEMS, 2021, 卷号: 51, 期号: 8, 页码: 5116-5128
作者:  Gao, Kaiye;  Yan, Xiangbin;  Peng, Rui;  Xing, Liudong
收藏  |  浏览/下载：153/0  |  提交时间：2021/10/26
Silicon  Reliability  Propagation losses  Economics  Resource management  Random variables  Telecommunications  Costs  expected receivable signal fraction  linear multistate consecutively connected system (LMCCS)  reliability  signal loss  universal generating function (UGF)  
An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 10, 页码: 1788-1799
作者:  Zhou, Hao;  Zhu, Hengliang;  Cui, Tao;  Pan, David Z.;  Zhou, Dian;  Zeng, Xuan
收藏  |  浏览/下载：165/0  |  提交时间：2018/11/16
Domain decomposition (DD)  drop test  reliability  through-silicon via (TSV)  
Subspace Correction Method for Computing Magnetic Shields in Large Power Transformers 期刊论文
IEEE TRANSACTIONS ON MAGNETICS, 2015, 卷号: 51, 期号: 5, 页码: 6
作者:  Zheng, Weiying;  Chen, Xinhong
收藏  |  浏览/下载：91/0  |  提交时间：2018/07/30
Eddy current problem  finite-element method  grain-oriented (GO) silicon steel lamination  subspace correction method (SCM)  
Numerical analysis for systems with memory arising from semiconductor simulations 期刊论文
APPLIED MATHEMATICS AND COMPUTATION, 1999, 卷号: 105, 期号: 2-3, 页码: 101-119
作者:  Allegretto, W;  Lin, Y;  Zhou, A
收藏  |  浏览/下载：95/0  |  提交时间：2018/07/30