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Funding Project：National Natural Science Foundation of China Research Project[61376040]
Source Publication：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
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An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs
期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 10, 页码: 1788-1799
Authors:
Zhou, Hao
;
Zhu, Hengliang
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Cui, Tao
;
Pan, David Z.
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Zhou, Dian
;
Zeng, Xuan
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Submit date：2018/11/16
Domain decomposition (DD)
drop test
reliability
through-silicon via (TSV)
