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Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method
Zhou, Hao; Zhu, Hengliang; Cui, Tao; Pan, David Z.; Zhou, Dian; Zeng, Xuan
2018
Source PublicationIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS
Volume26Issue:7Pages:1312
Document Type期刊论文
Identifierhttp://ir.amss.ac.cn/handle/2S8OKBNM/33717
Collection中国科学院数学与系统科学研究院
Recommended Citation
GB/T 7714
Zhou, Hao,Zhu, Hengliang,Cui, Tao,et al. Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method[J]. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS,2018,26(7):1312.
APA Zhou, Hao,Zhu, Hengliang,Cui, Tao,Pan, David Z.,Zhou, Dian,&Zeng, Xuan.(2018).Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method.IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS,26(7),1312.
MLA Zhou, Hao,et al."Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method".IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS 26.7(2018):1312.
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