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An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs
Zhou, Hao; Zhu, Hengliang; Cui, Tao; Pan, David Z.; Zhou, Dian; Zeng, Xuan
2018
Source PublicationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume8Issue:10Pages:1788
Document Type期刊论文
Identifierhttp://ir.amss.ac.cn/handle/2S8OKBNM/33569
Collection中国科学院数学与系统科学研究院
Recommended Citation
GB/T 7714
Zhou, Hao,Zhu, Hengliang,Cui, Tao,et al. An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(10):1788.
APA Zhou, Hao,Zhu, Hengliang,Cui, Tao,Pan, David Z.,Zhou, Dian,&Zeng, Xuan.(2018).An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,8(10),1788.
MLA Zhou, Hao,et al."An Improved Domain Decomposition Method for Drop Impact Reliability Analysis of 3-D ICs".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 8.10(2018):1788.
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